HIGH PERFORMANCE EPOXY PREFORMS Individual Preforms are Mounted to Ceramic, Glass, or Metal Caps and Lids High shear, peel, and cleavage strengths over a wide temperature range Excellent adhesion to metal, glass, and ceramic High degree of film clarity when in contact with a solid surface Good uncured film integrity, light in weight and easy to handle Relatively low bonding pressures may be used Stable at room temperature for long periods of time Can be shipped unrefrigerated at low cost

North Penn Technology's Epoxy film is an unsupported film, designed for high strength bonding of caps and lids of semiconductor pcakages. It is stable at room temperature for long periods of time, allowing it to be die cut into preforms of closely controlled dimensions. The material is thermally cured to give high bond strengths between many materails, and will bond metal to metal, glass to metal, ceramic to ceramic, ceramic to metal, and other sandwich combinations. High shear and peel strengths up to 12,000 psi on steels and peel strengths up to 300 inch/lbs on metal sandwich systems are common. The film has been evaluated against requirements of Fed. Spec. MMM-A-132, Type 1, Class 1, and found to surpass all requirements by a wide margin.

MEG-150 A dry, nonvolatile, unsupported elastomeric film containing active epoxide groups and curing agents. THICKNESS: 0.009" ± 0.0005" COLOR: Opaque white WEIGHT: 0.050 ± 0.005lbs/ft² ASSEMBLE TEMP: 165-175°C, 1 HOUR ASSEMBLE PRESSURE: 25psi

MEG-165 A dry, nonvolatile, unsupported epoxy co-polymer film. THICKNESS: 0.003" ± 0.0005" COLOR: Translucent white WEIGHT: 0.020 ± 0.005lbs/ft² ASSEMBLE TEMP: 165-175°C, 1 HOUR ASSEMBLE PRESSURE: 25psi