✕
Support
About Us
Solutions
Die & Wafer Solutions
Component Modification
Products & Services
Global
- Component Design & Packaging
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Multi-Chip Modules (MCMs)
- Wafer Bumping & WLP
- Design, Packaging & Assembly
- Assembly Services
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- Hi-Rel ICs & Components
- DLA/DSCC Certified Products
- QML/SMD 5962
- Function
- Memory
- Optocouplers
- Logic Devices
- Analog
- High Temp
- Passives
- Nuclear Event Detector (NED)
- Hi-Rel Power Solutions
- Hi-Rel RF Solutions
- Component Design & Packaging
- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- Hi-Rel Data Bus Couplers & Harnesses
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
- Hi-Rel Diodes
Maximizing Value & Performance in DC-DC Power Supply for Space Systems
Live Webinar
In this webinar, industry experts in Hi-Rel power electronics design, packaging, testing, and qualification of Hybrid and Space-Grade PCB DC-DC power supplies, will provide the latest options and best practices in realizing the optimal power supplies for today’s high-reliability applications.
May 2, 2024 @ 11AM ET
- Component Modification
- CMS - Crewe, UK
$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release
Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.
November 27, 2023
