- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross provides semiconductor die/wafer procurement & storage as well as large-capacity bare die banks, which can hold stock from a single diffusion run to assure homogeneity. Products are stored in a dedicated ESD-controlled environment in special smoke and water-resistant containers within a dry nitrogen environment that prevents contamination. The storage area is highly-secure and confined with bonded inventory control.
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Die Banking Capabilities Include:
- Access to a product years after the LTB date
- Cost-effective extension of project life, eliminating the need for a redesign
- Environmentally safe storage that prevents deterioration
- Bare die products can be safely stored for many years
- We offer expertise in bare die and wafer handling
- We have a large storage capacity and can store die at multiple sites
- Store EOL Die for long-term sustainment - See EDSP
Wafers/Die Procurement & Storage Include:
- Micross procures or receives customer consigned inventory – specified semiconductor wafer or die materials using front end part number – delivers C of C to customer, and holds in long term storage to be shipped as required
- Front end/back end terms include predefined finished goods delivery schedule and disposition instructions for unused materials
