- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Together, ISOCOM Ltd. and Micross serve the world's most innovative electronics companies, helping them to achieve greater performance, reliability, and system optimization. With ISOCOM’s Optocoupler technologies, and Micross’ best-in-class end-to-end microelectronics capabilities, our solutions enable greater power efficiency and space savings, enhance performance, and allow more features to achieve design optimization in the most challenging environments
Optocouplers/Opto-Isolators Offered:
- Transistors
- AC-DC Logic Interfaces
- High Speed
- High Gain/Photon
- High Isolation
- High Voltage
- Linear and Zero Crossing Triac
