- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross continues to deliver unprecedented performance to its customers when it comes to servicing all Component (Level 1)/System Level (Level 2) Qualification & Reliability evaluation needs.
Micross employs state-of-the-art test equipment to provide reliability solutions for ICs, tools for materials analysis including non-interrupt HTOL using advanced 256 channel drivers, latest ESD/LU equipment, Acoustic Imaging (CSAM) and real-time X-ray imaging.
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Flyer - Micross Environmental Testing
Webinar - Preparing Microelectronics for Hi-Rel Applications